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Flexible Electronics: Fabrication and Ubiquitous Integration

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ISBN: 9783038978282 9783038978299 Year: Pages: 160 DOI: 10.3390/books978-3-03897-829-9 Language: English
Publisher: MDPI - Multidisciplinary Digital Publishing Institute
Subject: Technology (General) --- General and Civil Engineering --- Electrical and Nuclear Engineering
Added to DOAB on : 2019-06-26 08:44:06
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Flexible Electronics platforms are increasingly used in the fields of sensors, displays, and energy conversion with the ultimate goal of facilitating their ubiquitous integration in our daily lives. Some of the key advantages associated with flexible electronic platforms are: bendability, lightweight, elastic, conformally shaped, nonbreakable, roll-to-roll manufacturable, and large-area. To realize their full potential, however, it is necessary to develop new methods for the fabrication of multifunctional flexible electronics at a reduced cost and with an increased resistance to mechanical fatigue. Accordingly, this Special Issue seeks to showcase short communications, research papers, and review articles that focus on novel methodological development for the fabrication, and integration of flexible electronics in healthcare, environmental monitoring, displays and human-machine interactivity, robotics, communication and wireless networks, and energy conversion, management, and storage.

Development of CMOS-MEMS/NEMS Devices

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ISBN: 9783039210688 9783039210695 Year: Pages: 165 DOI: 10.3390/books978-3-03921-069-5 Language: English
Publisher: MDPI - Multidisciplinary Digital Publishing Institute
Subject: Technology (General) --- General and Civil Engineering
Added to DOAB on : 2019-06-26 08:44:07
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Micro and nano-electro-mechanical system (M/NEMS) devices constitute key technological building blocks to enable increased additional functionalities within Integrated Circuits (ICs) in the More-Than-Moore era, as described in the International Technology Roadmap for Semiconductors. The CMOS ICs and M/NEMS dies can be combined in the same package (SiP), or integrated within a single chip (SoC). In the SoC approach the M/NEMS devices are monolithically integrated together with CMOS circuitry allowing the development of compact and low-cost CMOS-M/NEMS devices for multiple applications (physical sensors, chemical sensors, biosensors, actuators, energy actuators, filters, mechanical relays, and others). On-chip CMOS electronics integration can overcome limitations related to the extremely low-level signals in sub-micrometer and nanometer scale electromechanical transducers enabling novel breakthrough applications. This Special Issue aims to gather high quality research contributions dealing with MEMS and NEMS devices monolithically integrated with CMOS, independently of the final application and fabrication approach adopted (MEMS-first, interleaved MEMS, MEMS-last or others).]

MEMS/NEMS Sensors: Fabrication and Application

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ISBN: 9783039216345 9783039216352 Year: Pages: 242 DOI: 10.3390/books978-3-03921-635-2 Language: English
Publisher: MDPI - Multidisciplinary Digital Publishing Institute
Subject: Technology (General) --- General and Civil Engineering
Added to DOAB on : 2019-12-09 16:10:12
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Due to the ever-expanding applications of micro/nano-electromechanical systems (NEMS/MEMS) as sensors and actuators, interest in their development has rapidly expanded over the past decade. Encompassing various excitation and readout schemes, the MEMS/NEMS devices transduce physical parameter changes, such as temperature, mass or stress, caused by changes in desired measurands, to electrical signals that can be further processed. Some common examples of NEMS/MEMS sensors include pressure sensors, accelerometers, magnetic field sensors, microphones, radiation sensors, and particulate matter sensors. Despite a long history of development, fabrication of novel MEMS/NEMS devices still poses unique challenges due to their requirement for a suspended geometry; and many new fabrication techniques have been proposed to overcome these challenges. However, further development of these techniques is still necessary, as newer materials such as compound semiconductors, and 2-dimensional materials are finding their way in various MEMS/NEMS applications, with more complex structures and potentially smaller dimensions.

Keywords

thermoelectric power sensor --- wideband --- GaAs MMIC --- MEMS --- floating slug --- back cavity --- microwave measurement --- MEMS --- high temperature pressure sensors --- AlGaN/GaN circular HFETs --- GaN diaphragm --- adaptive control --- backstepping approach --- tracking performance --- microgyroscope --- resonant frequency --- resistance parameter --- micro fluidic --- oil detection --- MEMS --- microactuator --- magnetic --- micro-NIR spectrometer --- scanning grating mirror --- deflection position detector --- dual-mass MEMS gyroscope --- frequency tuning --- frequency split --- quadrature modulation signal --- frequency mismatch --- suspended micro hotplate --- single-layer SiO2 --- temperature uniformity --- power consumption --- infrared image --- MEMS (micro-electro-mechanical system) --- inertial switch --- acceleration switch --- threshold accuracy --- squeeze-film damping --- photonic crystal cavity --- photonic crystal nanobeam cavity --- optical sensor --- refractive index sensor --- nanoparticle sensor --- optomechanical sensor --- temperature sensor --- Accelerometer readout --- low noise --- low zero-g offset --- microfluidic --- femtosecond laser --- rapid fabrication --- glass welding --- bonding strength --- accelerometer design --- spring design --- analytical model --- gas sensor --- micropellistor --- microdroplet --- pulse inertia force --- methane --- tetramethylammonium hydroxide (TMAH) --- wet etching --- silicon --- 3D simulation --- level-set method --- single crystal silicon --- anisotropy --- vibrating ring gyroscope --- frequency split --- accelerometer --- tunnel magnetoresistive effect --- electrostatic force feedback --- n/a

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2019 (3)