Search results: Found 16

Listing 1 - 10 of 16 << page
of 2
>>
Sort by
Numerically Efficient Gradient Crystal Plasticity with a Grain Boundary Yield Criterion and Dislocation-based Work-Hardening

Author:
Book Series: Schriftenreihe Kontinuumsmechanik im Maschinenbau / Karlsruher Institut für Technologie, Institut für Technische Mechanik - Bereich Kontinuumsmechanik ISSN: 2192693X ISBN: 9783731502456 Year: Volume: 5 Pages: XIII, 260 p. DOI: 10.5445/KSP/1000042280 Language: ENGLISH
Publisher: KIT Scientific Publishing
Subject: Technology (General)
Added to DOAB on : 2019-07-30 20:01:58
License:

Loading...
Export citation

Choose an application

Abstract

This book is a contribution to the further development of gradient plasticity. Several open questions are addressed, where the efficient numerical implementation is particularly focused on. Thebook inspects an equivalent plastic strain gradient plasticity theory and a grain boundary yield model. Experiments can successfully be reproduced. The hardening model is based on dislocation densities evolving according to partial differential equations taking into account dislocation transport.

Radiation Tolerant Electronics

Author:
ISBN: 9783039212798 9783039212804 Year: Pages: 210 DOI: 10.3390/books978-3-03921-280-4 Language: English
Publisher: MDPI - Multidisciplinary Digital Publishing Institute
Subject: Technology (General) --- General and Civil Engineering --- Electrical and Nuclear Engineering
Added to DOAB on : 2019-12-09 11:49:15
License:

Loading...
Export citation

Choose an application

Abstract

Research on radiation-tolerant electronics has increased rapidly over the past few years, resulting in many interesting approaches to modeling radiation effects and designing radiation-hardened integrated circuits and embedded systems. This research is strongly driven by the growing need for radiation-hardened electronics for space applications, high-energy physics experiments such as those on the Large Hadron Collider at CERN, and many terrestrial nuclear applications including nuclear energy and nuclear safety. With the progressive scaling of integrated circuit technologies and the growing complexity of electronic systems, their susceptibility to ionizing radiation has raised many exciting challenges, which are expected to drive research in the coming decade. In this book we highlight recent breakthroughs in the study of radiation effects in advanced semiconductor devices, as well as in high-performance analog, mixed signal, RF, and digital integrated circuits. We also focus on advances in embedded radiation hardening in both FPGA and microcontroller systems and apply radiation-hardened embedded systems for cryptography and image processing, targeting space applications.

Keywords

physical unclonable function --- FPGA --- total ionizing dose --- Co-60 gamma radiation --- ring-oscillator --- Image processing --- line buffer --- SRAM-based FPGA --- single event upset (SEU) --- configuration memory --- soft error --- radiation-hardened --- instrumentation amplifier --- sensor readout IC --- total ionizing dose --- nuclear fusion --- radiation hardening --- hardening by design --- TMR --- selective hardening --- VHDL --- FPGA --- radiation hardening --- single event upsets --- heavy ions --- error rates --- single-event upsets (SEUs) --- digital integrated circuits --- triple modular redundancy (TMR) --- radiation hardening by design --- TMR --- FMR --- 4MR --- triplex–duplex --- FPGA-based digital controller --- radiation tolerant --- single event effects --- proton irradiation --- RFIC --- SEE testing --- space application --- CMOS --- TDC --- radiation effects --- total ionizing dose (TID) --- single-shot --- PLL --- ring oscillator --- analog single-event transient (ASET) --- bandgap voltage reference (BGR) --- CMOS analog integrated circuits --- gamma-rays --- heavy-ions --- ionization --- protons --- radiation hardening by design (RHBD) --- reference circuits --- single-event effects (SEE) --- space electronics --- total ionization dose (TID) --- voltage reference --- X-rays --- radiation-hardened --- single event gate rupture (SEGR) --- SEB --- power MOSFETs --- Single-Event Upsets (SEUs) --- radiation effects --- Ring Oscillators --- Impulse Sensitive Function --- Radiation Hardening by Design --- fault tolerance --- single event upset --- proton irradiation effects --- neutron irradiation effects --- soft errors --- saturation effect --- gain degradation --- total ionizing dose --- gamma ray --- bipolar transistor --- single event transient (SET) --- single event opset (SEU) --- radiation-hardening-by-design (RHBD) --- frequency synthesizers --- voltage controlled oscillator (VCO) --- frequency divider by two --- CMOS --- n/a

Modelling and Simulation of Sheet Metal Forming Processes

Authors: ---
ISBN: 9783039285563 / 9783039285570 Year: Pages: 254 DOI: 10.3390/books978-3-03928-557-0 Language: eng
Publisher: MDPI - Multidisciplinary Digital Publishing Institute
Subject: Technology (General) --- General and Civil Engineering
Added to DOAB on : 2020-06-09 16:38:57
License:

Loading...
Export citation

Choose an application

Abstract

The numerical simulation of sheet metal forming processes has become an indispensable tool for the design of components and their forming processes. This role was attained due to the huge impact in reducing time to market and the cost of developing new components in industries ranging from automotive to packing, as well as enabling an improved understanding of the deformation mechanisms and their interaction with process parameters. Despite being a consolidated tool, its potential for application continues to be discovered with the continuous need to simulate more complex processes, including the integration of the various processes involved in the production of a sheet metal component and the analysis of in-service behavior. The quest for more robust and sustainable processes has also changed its deterministic character into stochastic to be able to consider the scatter in mechanical properties induced by previous manufacturing processes. Faced with these challenges, this Special Issue presents scientific advances in the development of numerical tools that improve the prediction results for conventional forming process, enable the development of new forming processes, or contribute to the integration of several manufacturing processes, highlighting the growing multidisciplinary characteristic of this field.

Light Weight Alloys: Processing, Properties and Their Applications

Authors: ---
ISBN: 9783039289196 / 9783039289202 Year: Pages: 238 DOI: 10.3390/books978-3-03928-920-2 Language: eng
Publisher: MDPI - Multidisciplinary Digital Publishing Institute
Subject: Technology (General) --- General and Civil Engineering
Added to DOAB on : 2020-06-09 16:38:57
License:

Loading...
Export citation

Choose an application

Abstract

There is growing interest in light metallic alloys for a wide number of applications owing to their processing efficiency, processability, long service life, and environmental sustainability. Aluminum, magnesium, and titanium alloys are addressed in this Special Issue, however, the predominant role played by aluminum. The collection of papers published here covers a wide range of topics that generally characterize the performance of the alloys after manufacturing by conventional and innovative processing routes.

Keywords

aluminum alloy --- quenching process --- material property --- cooling rate --- plastic strain --- residual stress --- 2024-T4 aluminum alloys --- microarc oxidation --- anode pulse-width --- FEP --- adhesion strength --- wear resistance --- titanium aluminides --- hot compression --- dynamic recrystallization --- microstructure --- Al alloy --- remanufacturing --- hot rolling --- activation energy --- alloy --- 7XXX Al alloy --- spray deposited --- hot deformation behavior --- precipitation --- mechanical alloying --- Al–Si alloy --- mechanical properties --- consolidation --- Ti6Al4V titanium alloy --- resistance spot welding --- mechanical properties --- microstructure --- aluminum alloy --- 7003 alloy --- fatigue properties --- thermomechanical treatment --- fractography --- magnesium alloy --- compressive strength --- hot workability --- processing map --- hot forging --- Al-5Mg wire electrode --- Zr --- wire feedability --- microstructure --- mechanical properties --- commercially pure titanium --- rotary-die equal-channel angular pressing --- cold rolling --- ultra-fine grain --- tensile property --- creep --- hot working --- constitutive equations --- solid solution hardening --- high pressure die casting --- Al-Si-Cu alloys --- iron --- sludge --- intermetallics --- fatigue behavior --- high temperature --- tensile properties --- microstructural changes --- AlSi9Cu3(Fe) --- AlSi11Cu2(Fe) --- AlSi12Cu1(Fe) --- hydroforming --- springback --- FEM simulation --- UNS A92024-T3 --- hardening criteria --- selective laser melting --- AlSi10Mg alloy --- processing temperature --- aging treatment

Failure Mechanisms in Alloys

Author:
ISBN: 9783039282760 9783039282777 Year: Pages: 476 DOI: 10.3390/books978-3-03928-277-7 Language: English
Publisher: MDPI - Multidisciplinary Digital Publishing Institute
Subject: Technology (General) --- General and Civil Engineering
Added to DOAB on : 2020-04-07 23:07:09
License:

Loading...
Export citation

Choose an application

Abstract

The era of lean production and excellence in manufacturing, advancing with sustainable development, demands the rational utilization of raw materials and energy resources, adopting cleaner and environmentally-friendly industrial processes. In view of the new industrial revolution, through digital transformation, the exploitation of smart and sophisticated materials systems, the need of minimizing scrap and increasing efficiency, reliability and lifetime and, on the other hand, the pursuit of fuel economy and limitation of carbon footprint, are necessary conditions for the imminent growth in a highly competitive economy. Failure analysis is an interdisciplinary scientific topic, reflecting the opinions and interpretations coming from a systematic evidence-gathering procedure, embracing various important sectors, imparting knowledge, and substantiating improvement practices. The deep understanding of material/component role (e.g., rotating shaft, extrusion die, gas pipeline) and properties will be of central importance for fitness for purpose in certain industrial processes and applications. Finally, it is hoped and strongly believed that the accumulation of additional knowledge in the field of failure mechanisms and the adoption of the principles, philosophy, and deep understanding of failure analysis process approach will strongly promote the learning concept, as a continuously evolving process leading to personal and social progress and prosperity.

Keywords

impingement --- erosion corrosion --- API 5L-X65 --- flow loop --- wear scar --- creep fatigue --- crack growth --- grain boundary --- hydrogen-assisted cracking --- corrosion --- SOHIC --- cleavage fracture --- cold-working process --- surface-cracking process --- impact toughness --- strength --- low temperatures --- austenitic stainless steels --- pipeline steel --- tensile stress --- corrosion --- potentiodynamic polarization --- EIS --- brass extrusion --- CFD simulation --- extrusion failures --- plastic deformation processing --- finite element analysis --- inverse modeling --- post-necking hardening --- biaxial tensile test --- elevated temperature --- reliability design --- helix upper dispenser --- fracture --- parametric accelerated life testing --- faulty designs --- metal components --- fracture mechanisms --- fractography --- fracture mechanics --- quality improvement --- finite element modeling --- nanocrystalline materials --- elastic moduli --- yield strength --- cast duplex stainless steels --- thermal aging --- tensile deformation --- spinodal decomposition --- smooth particle hydrodynamics --- Titanium alloy machining --- numerical simulation --- cutting forces --- chip formation --- fracture --- iterative FEM Method --- GISSMO Model --- softening --- macroscopic strength criterion --- isotropic metals --- fracture plane --- linear Mohr–Coulomb criterion --- failure mechanism --- W-30Cu --- microstructure homogeneity --- dynamic compression strength --- ductility --- failure mechanism --- slow-rate machining --- chip formation --- shape --- temperature --- microhardness HV --- creep --- steam reforming --- carbides --- G-phase --- aging --- cast reformer tubes --- hot stamping --- press hardening --- austenitizing furnace --- high temperature fatigue --- thermal distortion --- conveying system --- refractory steels --- furnace component failure --- ductile irons --- tensile tests --- mechanical properties --- constitutive equations --- quality assessment --- shear angle --- chip root --- shape --- built-up edge --- slow-rate machining --- convection tubes --- AISI 304 stainless steel --- failure analysis --- sensitization --- bake hardening --- dent resistance --- failure study --- polynomial regression --- yield strength --- automotive steels --- reformer tubes --- HP-Mod --- failure analysis --- creep --- surface modification techniques --- degradation of protective layers --- lubrication --- nitrocarburizing --- hardfacings --- thermal-sprayed coatings --- finite element analysis --- forward slip prediction --- strip marking method --- multilinear regression --- micro flexible rolling --- thickness transition area --- 3D Voronoi modelling --- automotive --- 6063 Alloy --- EBSD --- bendability --- fractography --- modeling --- texture --- tribological properties --- wear --- surface treatment --- self-equalizing bearing --- n/a

Small Scale Deformation using Advanced Nanoindentation Techniques

Authors: ---
ISBN: 9783038979661 9783038979678 Year: Pages: 168 DOI: 10.3390/books978-3-03897-967-8 Language: English
Publisher: MDPI - Multidisciplinary Digital Publishing Institute
Subject: Technology (General)
Added to DOAB on : 2019-06-26 08:44:06
License:

Loading...
Export citation

Choose an application

Abstract

Small scale mechanical deformations have gained a significant interest over the past few decades, driven by the advances in integrated circuits and microelectromechanical systems. One of the most powerful and versatile characterization methods is the nanoindentation technique. The capabilities of these depth-sensing instruments have been improved considerably. They can perform experiments in vacuum and at high temperatures, such as in-situ SEM and TEM nanoindenters. This allows researchers to visualize mechanical deformations and dislocations motion in real time. Time-dependent behavior of soft materials has also been studied in recent research works. This Special Issue on ""Small Scale Deformation using Advanced Nanoindentation Techniques""; will provide a forum for researchers from the academic and industrial communities to present advances in the field of small scale contact mechanics. Materials of interest include metals, glass, and ceramics. Manuscripts related to deformations of biomaterials and biological related specimens are also welcome. Topics of interest include, but are not limited to:

Tribology and Surface Engineering

Author:
ISBN: 9783039280841 9783039280858 Year: Pages: 174 DOI: 10.3390/books978-3-03928-085-8 Language: English
Publisher: MDPI - Multidisciplinary Digital Publishing Institute
Subject: General and Civil Engineering --- Technology (General)
Added to DOAB on : 2020-01-30 16:39:46
License:

Advances in CAD/CAM/CAE Technologies

Authors: --- ---
ISBN: 9783039287406 / 9783039287413 Year: Pages: 116 DOI: 10.3390/books978-3-03928-741-3 Language: eng
Publisher: MDPI - Multidisciplinary Digital Publishing Institute
Subject: Technology (General) --- General and Civil Engineering
Added to DOAB on : 2020-06-09 16:38:57
License:

Loading...
Export citation

Choose an application

Abstract

CAD/CAM/CAE technologies find more and more applications in today’s industries, e.g., in the automotive, aerospace, and naval sectors. These technologies increase the productivity of engineers and researchers to a great extent, while at the same time allowing their research activities to achieve higher levels of performance. A number of difficult-to-perform design and manufacturing processes can be simulated using more methodologies available, i.e., experimental work combined with statistical tools (regression analysis, analysis of variance, Taguchi methodology, deep learning), finite element analysis applied early enough at the design cycle, CAD-based tools for design optimizations, CAM-based tools for machining optimizations.

Microstructure and Mechanical Properties of Structural Metals and Alloys

Author:
ISBN: 9783038975052 9783038975069 Year: Pages: 272 DOI: 10.3390/books978-3-03897-506-9 Language: English
Publisher: MDPI - Multidisciplinary Digital Publishing Institute
Subject: Technology (General) --- Chemical Engineering
Added to DOAB on : 2019-06-26 08:44:06
License:

Loading...
Export citation

Choose an application

Abstract

The papers collected in this special issue clearly reflect the modern research trends in materials science. These fields of specific attention are high-Mn TWIP steels, high-Cr heat resistant steels, aluminum alloys, ultrafine grained materials including those developed by severe plastic deformation, and high-entropy alloys. The major portion of the collected papers is focused on the mechanisms of microstructure evolution and the mechanical properties of metallic materials subjected to various thermo-mechanical, deformation or heat treatments. Another large portion of the studies is aimed on the elaboration of alloying design of advanced steels and alloys. The changes in phase content, transformation and particle precipitation and their effect on the properties are also broadly presented in this collection, including the microstructure/property changes caused by irradiation.

Keywords

Mg–Sm–Zn–Zr --- dynamic precipitation --- microstructure --- mechanical property --- bimodal ferrite steel --- ultrafine-grained microstructure --- mechanical properties --- corrosion resistance --- abnormal grain growth --- grain boundary engineering --- electron backscattered diffraction --- growth rate --- Al metal matrix composites --- microstructure --- mechanical properties --- strengthening mechanism --- hot compression --- dynamic recovery --- dynamic recrystallization --- texture --- aluminum alloys --- Al-Fe-Si-Zr system --- microstructure --- hardness --- electrical conductivity --- metal–matrix composite --- high-pressure torsion --- microstructure evolution --- microhardness --- shape memory alloy --- columnar grain --- Cu-Al-Mn --- elastocaloric effect --- strain rate --- measuring temperature --- creep --- lead-free solder --- Sb solder --- Sn-8.0Sb-3.0Ag --- solder microstructure --- martensitic steels --- creep --- precipitation --- electron microscopy --- high-Mn TWIP steel --- cold rolling --- annealing --- recovery --- recrystallization --- strengthening --- austenitic 304 stainless steels --- sub-merged arc welding --- post-weld heat treatment --- aluminum alloys --- aging --- precipitation --- electrical resistivity --- mechanical properties --- ferritic steel --- irradiation --- nanoindentation --- hardness --- transmission electron microscopy (TEM) --- microstructure --- high-entropy alloys --- high-pressure torsion --- microstructure evolution --- twinning --- mechanical properties --- welded rotor --- weld metal --- impact toughness --- PWHT --- microstructure evolution --- Cu-Cr-Zr --- precipitation --- orientation relationship --- recrystallization --- annealing twins --- structural steel plate --- nonmetallic inclusions --- rare earth control --- M23C6 --- ion irradiation --- M6C --- amorphization --- RAFM steels --- hot stamping --- press hardening --- martensitic expansion --- force peak --- cycle time --- high-Mn steel --- deformation twinning --- dynamic recrystallization --- grain refinement --- work hardening --- in situ tensile testing --- super duplex stainless steel --- SDSS --- low-temperature --- ?-phase --- SEM --- EBSD --- microstructure analysis --- n/a

Soft Material-Enabled Electronics for Medicine, Healthcare, and Human-Machine Interfaces

Authors: ---
ISBN: 9783039282821 9783039282838 Year: Pages: 244 DOI: 10.3390/books978-3-03928-283-8 Language: English
Publisher: MDPI - Multidisciplinary Digital Publishing Institute
Subject: Technology (General) --- General and Civil Engineering
Added to DOAB on : 2020-04-07 23:07:09
License:

Loading...
Export citation

Choose an application

Abstract

Soft material-enabled electronics offer distinct advantage, over conventional rigid and bulky devices, for numerous wearable and implantable applications. Soft materials allow for seamless integration with skin and tissues due to enhanced mechanical flexibility and stretchability. Wearable devices, such as sensors, offer continuous, real-time monitoring of biosignals and movements, which can be applied in rehabilitation and diagnostics, among other applications. Soft implantable electronics offer similar functionalities, but with improved compatibility with human tissues. Biodegradable soft implantable electronics are also being developed for transient monitoring, such as in the weeks following surgery. To further advance soft electronics, materials, integration strategies, and fabrication techniques are being developed. This paper reviews recent progress in these areas, toward the development of soft material-enabled electronics for medicine, healthcare, and human-machine interfaces.

Keywords

soft materials --- flexible hybrid electronics --- wearable electronics --- stretchable electronics --- medicine --- healthcare --- human-machine interfaces --- point-of-care testing --- soft material-based channel --- PDMS optical filter --- smartphone-based biosensor --- chromogenic biochemical assay --- naked-eye detection --- implantable materials --- low-profile bioelectronics --- micro/nanofabrication --- medical devices --- biodegradable materials --- miniaturization --- bioresorbable electronics --- printing electronics techniques --- conductive inks --- flexible electronics --- carbon-based nano-materials --- bio-integrated electronics --- hardening sponge --- MR sponge --- 6 degrees-of-freedom (6-DOF) MR haptic master --- RMIS (robot-assisted minimally invasive surgery) --- implantable devices --- optical waveguides --- optical fibers --- biocompatible --- biodegradable --- electroactive hydrogel --- polyvinyl alcohol --- cellulose nanocrystals --- freeze–thaw method --- actuation --- biodegradable electronics --- transient electronics --- soft biomedical electronics --- biodegradable materials --- silver nanowire --- graphene oxide --- polymer-dispersed liquid crystal --- smart window --- hybrid transparent conductive electrode --- conductive textile --- capacitive pressure sensor --- gait --- monitoring --- phase coordination index --- stretchable --- polydimethylsiloxane --- liquid-metal --- capacitor --- dysphagia --- swallowing --- tongue --- nitinol --- superelastic --- prosthesis --- soft materials --- wearable electronics --- implantable electronics --- biodegradable --- medical devices --- diagnostics --- health monitoring --- human-machine interfaces

Listing 1 - 10 of 16 << page
of 2
>>
Sort by
Narrow your search