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MEMS/NEMS Sensors: Fabrication and Application

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ISBN: 9783039216345 9783039216352 Year: Pages: 242 DOI: 10.3390/books978-3-03921-635-2 Language: English
Publisher: MDPI - Multidisciplinary Digital Publishing Institute
Subject: Technology (General) --- General and Civil Engineering
Added to DOAB on : 2019-12-09 16:10:12
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Abstract

Due to the ever-expanding applications of micro/nano-electromechanical systems (NEMS/MEMS) as sensors and actuators, interest in their development has rapidly expanded over the past decade. Encompassing various excitation and readout schemes, the MEMS/NEMS devices transduce physical parameter changes, such as temperature, mass or stress, caused by changes in desired measurands, to electrical signals that can be further processed. Some common examples of NEMS/MEMS sensors include pressure sensors, accelerometers, magnetic field sensors, microphones, radiation sensors, and particulate matter sensors. Despite a long history of development, fabrication of novel MEMS/NEMS devices still poses unique challenges due to their requirement for a suspended geometry; and many new fabrication techniques have been proposed to overcome these challenges. However, further development of these techniques is still necessary, as newer materials such as compound semiconductors, and 2-dimensional materials are finding their way in various MEMS/NEMS applications, with more complex structures and potentially smaller dimensions.

Keywords

thermoelectric power sensor --- wideband --- GaAs MMIC --- MEMS --- floating slug --- back cavity --- microwave measurement --- MEMS --- high temperature pressure sensors --- AlGaN/GaN circular HFETs --- GaN diaphragm --- adaptive control --- backstepping approach --- tracking performance --- microgyroscope --- resonant frequency --- resistance parameter --- micro fluidic --- oil detection --- MEMS --- microactuator --- magnetic --- micro-NIR spectrometer --- scanning grating mirror --- deflection position detector --- dual-mass MEMS gyroscope --- frequency tuning --- frequency split --- quadrature modulation signal --- frequency mismatch --- suspended micro hotplate --- single-layer SiO2 --- temperature uniformity --- power consumption --- infrared image --- MEMS (micro-electro-mechanical system) --- inertial switch --- acceleration switch --- threshold accuracy --- squeeze-film damping --- photonic crystal cavity --- photonic crystal nanobeam cavity --- optical sensor --- refractive index sensor --- nanoparticle sensor --- optomechanical sensor --- temperature sensor --- Accelerometer readout --- low noise --- low zero-g offset --- microfluidic --- femtosecond laser --- rapid fabrication --- glass welding --- bonding strength --- accelerometer design --- spring design --- analytical model --- gas sensor --- micropellistor --- microdroplet --- pulse inertia force --- methane --- tetramethylammonium hydroxide (TMAH) --- wet etching --- silicon --- 3D simulation --- level-set method --- single crystal silicon --- anisotropy --- vibrating ring gyroscope --- frequency split --- accelerometer --- tunnel magnetoresistive effect --- electrostatic force feedback --- n/a

Science, Characterization and Technology of Joining and Welding

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ISBN: 9783039289974 / 9783039289981 Year: Pages: 251 DOI: 10.3390/books978-3-03928-998-1 Language: eng
Publisher: MDPI - Multidisciplinary Digital Publishing Institute
Subject: Technology (General) --- General and Civil Engineering
Added to DOAB on : 2020-06-09 16:38:57
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As the Guest Editor of this Special Issue entitled ""Science, Characterization, and Technology of Joining and Welding"" of Metals, I am pleased to have this book published by MDPI. Joining, including welding, soldering, brazing, and assembly, is an essential requirement in manufacturing processes and is classified as a secondary manufacturing process. This Special Issue of Metals includes technical and review papers on, but not limited to, different aspects of joining and welding, including welding technologies (i.e., fusion-based welding and solid-state welding), characterization, metallurgy and materials science, quality control, and design and numerical simulation. This Special Issue also includes the joining of different materials, including metal and non-metals (polymers and composites), including 17 peer-reviewed papers from several researchers all around the globe (China, Germany, Brazil, South Koria, Slovakia, USA, Taiwan, Canada, and India). As of this date (April 2020), the papers in this Special Issue have been cited 47 times by other researchers, which I think is an eminent number and shows the high quality of the published papers in this Issue. This Special Issue includes a large diversity of various subjects in the field of joining: laser welding, friction stir welding, diffusion bonding, multipass welding, rotary friction-welding, friction bit joining, adhesive bonding, weldbonding, simulation and experimentation, metal/FRP joints, welding simulation, plasma–TIG coupled arc welding, liquation cracking, soldering, resin bonding, microstructural characteristics, brazing, and friction stir butt and scarf welding. I would like to sincerely thank all the researchers who contributed to this Special Issue for their high-quality research. I also would like to acknowledge Mr. Toliver Guo, Senior Assistant Editor at MDPI, who continuously and tirelessly contributed toward this Special Issue by assisting me with inviting the authors and the follow ups. I think this Special Issue will enhance our knowledge and understanding in the field of joining and assembly. I would like to dedicate this book to my wife, Mehrnoosh, for her continued support and encouragement.

Keywords

adhesive thermos-mechanical property --- SnBi58 solder joint morphology --- flex-on-board assembly --- thermal compression bonding --- ultrasonic bonding --- friction stir welding --- scarf joint --- butt joint --- tool pin profiles --- mechanical properties --- microstructure --- metallurgy --- vacuum brazing --- titanium --- eutectoid --- clad filler foil --- microstructure --- SA213-T23 --- Cr-Mo steel --- heat-affected zone --- m23c6 --- carbide dissolution --- tint etching --- high-crystalline content zirconia --- active monomers --- oxide layer --- solder --- ceramics --- copper --- flux-less soldering --- IN738 superalloy --- welding --- HAZ cracking --- microconstituent --- plasma-TIG --- coupled arc --- arc profile --- pressure distribution --- welding --- 22MnB5 --- flow stress --- thermophysical property --- numerical simulation --- hybrid joining --- surface structuring --- thermal spraying --- coating --- FRP --- hot pressing --- bonding strength --- adhesion --- mechanical interlocking --- phased array ultrasonic --- dissimilar weldments --- anisotropy --- longitudinal wave --- simulation --- dissimilar material joining --- carbon fiber-reinforced polymer --- dual-phase steel --- friction bit joining --- adhesive bonding --- weld bonding --- mechanical strength --- rotary friction-welding --- energy-input --- joint mechanical properties --- welding thermal cycles --- medium thick plate model --- distributed point heat sources model --- local brittle zone --- API 5L X80 steel --- Ti2AlNb alloy --- TAN alloy --- direct diffusion bonding --- interfacial microstructure --- mechanical properties --- friction stir welding --- aluminum --- copper --- dissimilar joints --- design of experiments --- taguchi design --- mechanical properties --- electrical properties --- tailor welded blanks --- laser welding --- Zn-coated low carbon microalloyed steels --- microstructure --- pores

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