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Sensors for Ultrasonic NDT in Harsh Environments

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ISBN: 9783039284221 / 9783039284238 Year: Pages: 120 DOI: 10.3390/books978-3-03928-423-8 Language: eng
Publisher: MDPI - Multidisciplinary Digital Publishing Institute
Subject: Technology (General) --- General and Civil Engineering
Added to DOAB on : 2020-06-09 16:38:57
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In this Special Issue of Sensors, seven peer-reviewed manuscripts appear on the topic of ultrasonic transducer design and operation in harsh environments: elevated temperature, high gamma and neutron radiation fields, or the presence of aggressive chemicals. Motivations for these research and development projects are strongly focused on nuclear power plant inspections (particularly liquid-sodium cooled reactors), and nondestructive testing of high-temperature piping installations. It is anticipated that extensive use of permanently mounted robust transducers for in-service monitoring of petrochemical plants and power generations stations; quality control in manufacturing plants; and primary and secondary process monitoring in the fabrication of engineering materials will soon be made.

Science, Characterization and Technology of Joining and Welding

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ISBN: 9783039289974 / 9783039289981 Year: Pages: 251 DOI: 10.3390/books978-3-03928-998-1 Language: eng
Publisher: MDPI - Multidisciplinary Digital Publishing Institute
Subject: Technology (General) --- General and Civil Engineering
Added to DOAB on : 2020-06-09 16:38:57
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As the Guest Editor of this Special Issue entitled ""Science, Characterization, and Technology of Joining and Welding"" of Metals, I am pleased to have this book published by MDPI. Joining, including welding, soldering, brazing, and assembly, is an essential requirement in manufacturing processes and is classified as a secondary manufacturing process. This Special Issue of Metals includes technical and review papers on, but not limited to, different aspects of joining and welding, including welding technologies (i.e., fusion-based welding and solid-state welding), characterization, metallurgy and materials science, quality control, and design and numerical simulation. This Special Issue also includes the joining of different materials, including metal and non-metals (polymers and composites), including 17 peer-reviewed papers from several researchers all around the globe (China, Germany, Brazil, South Koria, Slovakia, USA, Taiwan, Canada, and India). As of this date (April 2020), the papers in this Special Issue have been cited 47 times by other researchers, which I think is an eminent number and shows the high quality of the published papers in this Issue. This Special Issue includes a large diversity of various subjects in the field of joining: laser welding, friction stir welding, diffusion bonding, multipass welding, rotary friction-welding, friction bit joining, adhesive bonding, weldbonding, simulation and experimentation, metal/FRP joints, welding simulation, plasma–TIG coupled arc welding, liquation cracking, soldering, resin bonding, microstructural characteristics, brazing, and friction stir butt and scarf welding. I would like to sincerely thank all the researchers who contributed to this Special Issue for their high-quality research. I also would like to acknowledge Mr. Toliver Guo, Senior Assistant Editor at MDPI, who continuously and tirelessly contributed toward this Special Issue by assisting me with inviting the authors and the follow ups. I think this Special Issue will enhance our knowledge and understanding in the field of joining and assembly. I would like to dedicate this book to my wife, Mehrnoosh, for her continued support and encouragement.

Keywords

adhesive thermos-mechanical property --- SnBi58 solder joint morphology --- flex-on-board assembly --- thermal compression bonding --- ultrasonic bonding --- friction stir welding --- scarf joint --- butt joint --- tool pin profiles --- mechanical properties --- microstructure --- metallurgy --- vacuum brazing --- titanium --- eutectoid --- clad filler foil --- microstructure --- SA213-T23 --- Cr-Mo steel --- heat-affected zone --- m23c6 --- carbide dissolution --- tint etching --- high-crystalline content zirconia --- active monomers --- oxide layer --- solder --- ceramics --- copper --- flux-less soldering --- IN738 superalloy --- welding --- HAZ cracking --- microconstituent --- plasma-TIG --- coupled arc --- arc profile --- pressure distribution --- welding --- 22MnB5 --- flow stress --- thermophysical property --- numerical simulation --- hybrid joining --- surface structuring --- thermal spraying --- coating --- FRP --- hot pressing --- bonding strength --- adhesion --- mechanical interlocking --- phased array ultrasonic --- dissimilar weldments --- anisotropy --- longitudinal wave --- simulation --- dissimilar material joining --- carbon fiber-reinforced polymer --- dual-phase steel --- friction bit joining --- adhesive bonding --- weld bonding --- mechanical strength --- rotary friction-welding --- energy-input --- joint mechanical properties --- welding thermal cycles --- medium thick plate model --- distributed point heat sources model --- local brittle zone --- API 5L X80 steel --- Ti2AlNb alloy --- TAN alloy --- direct diffusion bonding --- interfacial microstructure --- mechanical properties --- friction stir welding --- aluminum --- copper --- dissimilar joints --- design of experiments --- taguchi design --- mechanical properties --- electrical properties --- tailor welded blanks --- laser welding --- Zn-coated low carbon microalloyed steels --- microstructure --- pores

Signal Processing and Analysis of Electrical Circuit

Authors: --- ---
ISBN: 9783039282944 9783039282951 Year: Pages: 604 DOI: 10.3390/books978-3-03928-295-1 Language: English
Publisher: MDPI - Multidisciplinary Digital Publishing Institute
Subject: Technology (General) --- General and Civil Engineering
Added to DOAB on : 2020-04-07 23:07:09
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This Special Issue with 35 published articles shows the significance of the topic “Signal Processing and Analysis of Electrical Circuit”. This topic has been gaining increasing attention in recent times. The presented articles can be categorized into four different areas: signal processing and analysis methods of electrical circuits; electrical measurement technology; applications of signal processing of electrical equipment; fault diagnosis of electrical circuits. It is a fact that the development of electrical systems, signal processing methods, and circuits has been accelerating. Electronics applications related to electrical circuits and signal processing methods have gained noticeable attention in recent times. The methods of signal processing and electrical circuits are widely used by engineers and scientists all over the world. The constituent papers represent a significant contribution to electronics and present applications that can be used in industry. Further improvements to the presented approaches are required for realizing their full potential.

Keywords

VMD --- signal analysis --- ICEEMD --- IMF --- random noise --- attenuation --- commutator motor --- fault diagnosis --- method --- technique --- signal processing --- acoustic --- Inner and outer product --- tensor --- FPGA --- hardware --- direct digital synthesizer (DDS) --- frequency tuning word (FTW) --- stability --- accuracy --- demodulation --- phase-locked loop --- Chebyshev filter --- measurement noise suppression --- class AB operation --- CMOS --- current mirror --- current buffer --- quasi floating gate --- low power --- CMOS --- dynamic comparator --- offset calibration --- high speed --- low noise --- low power --- ADC --- all-pass filter --- CMOS --- time delay --- broadband --- true-time-delay --- electrochemical impedance spectroscopy --- FRA --- multichannel acquisition --- impedance spectrometry --- microcontroller --- intelligent vehicles --- LiDAR odometry --- range sensing --- simultaneous localization and mapping (SLAM) --- tilt sensor --- sensor data fusion --- complementary filters --- overlap-add processing --- spectral analysis --- variational mode decomposition (VMD) --- duffing chaotic oscillator (DCO) --- permutation entropy (PE) --- feature extraction --- frequency characteristic --- underwater acoustic signal --- ship-radiated noise --- PM/PWM --- capacitance-to-time conversion --- differential capacitive sensor --- brick-wall filter --- fuzzy logic --- induction motor --- Shannon entropy --- short-circuit fault --- APF --- CNFET --- pole-frequency --- chirality --- phase angle --- tuning --- DC–DC converter --- switched capacitor --- power management integrated circuit --- CMOS technology --- frequency standard comparator --- dual Mixing Time difference --- phase difference --- correlation function --- chebyshev polynomial --- compressed sensing --- estimated sparsity --- least squares solution --- stochastic gradient --- reconstruction probability --- direct position determination --- array signal processing --- Doppler shifts --- matrix eigen-perturbation theory --- system errors --- Cramér–Rao bound --- differential power analysis (DPA), SIMON --- fault injection --- double rate --- power randomization --- intention of movement classification --- EMG-Signals --- Support Vector Machines --- asynchronous --- delay cell --- passive resistor --- SAR ADC --- loop delay circuit --- Resistance-to-Period converter --- robust read-out circuits --- ratiometric technique --- Fresnel lens --- wingbeat --- insects --- optoelectronics --- bees --- wasps --- fruit flies --- e-traps --- analog-to-digital converter --- successive approximation register --- direct sampling --- time-interleaved --- channel-selection-embedded bootstrap --- segmented pre-quantization and bypass --- LVDS --- high-speed serial interface --- transmitter --- receiver --- low-power --- image fusion --- multi-sensor fusion --- night vision --- hierarchical heterogeneous multi-DAG workflow --- multigroup scan --- ultrasonic phased array --- heterogeneous earliest finish time --- resolver --- discrete wavelet transform --- singular value decomposition --- automatic calibration --- noise reduction --- ripple voltage measurement --- DAC --- comparator --- peak-ripple estimation --- binary search --- low-cost --- secret image sharing --- digital image --- n-out-of-n scheme --- color palette --- colluder attack --- image restoration --- impulse noise --- ADMM --- HOCTVL1 --- spatially adapted regularization parameter --- rod electrode --- electrostatic induction --- method of images --- induced charge --- induced current --- 3D-IC design --- NILT --- TSV noise coupling --- RDL --- chain matrix --- interconnect line --- n/a

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eng (2)

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2020 (3)