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Science, Characterization and Technology of Joining and Welding

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ISBN: 9783039289974 / 9783039289981 Year: Pages: 251 DOI: 10.3390/books978-3-03928-998-1 Language: eng
Publisher: MDPI - Multidisciplinary Digital Publishing Institute
Subject: Technology (General) --- General and Civil Engineering
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As the Guest Editor of this Special Issue entitled ""Science, Characterization, and Technology of Joining and Welding"" of Metals, I am pleased to have this book published by MDPI. Joining, including welding, soldering, brazing, and assembly, is an essential requirement in manufacturing processes and is classified as a secondary manufacturing process. This Special Issue of Metals includes technical and review papers on, but not limited to, different aspects of joining and welding, including welding technologies (i.e., fusion-based welding and solid-state welding), characterization, metallurgy and materials science, quality control, and design and numerical simulation. This Special Issue also includes the joining of different materials, including metal and non-metals (polymers and composites), including 17 peer-reviewed papers from several researchers all around the globe (China, Germany, Brazil, South Koria, Slovakia, USA, Taiwan, Canada, and India). As of this date (April 2020), the papers in this Special Issue have been cited 47 times by other researchers, which I think is an eminent number and shows the high quality of the published papers in this Issue. This Special Issue includes a large diversity of various subjects in the field of joining: laser welding, friction stir welding, diffusion bonding, multipass welding, rotary friction-welding, friction bit joining, adhesive bonding, weldbonding, simulation and experimentation, metal/FRP joints, welding simulation, plasma–TIG coupled arc welding, liquation cracking, soldering, resin bonding, microstructural characteristics, brazing, and friction stir butt and scarf welding. I would like to sincerely thank all the researchers who contributed to this Special Issue for their high-quality research. I also would like to acknowledge Mr. Toliver Guo, Senior Assistant Editor at MDPI, who continuously and tirelessly contributed toward this Special Issue by assisting me with inviting the authors and the follow ups. I think this Special Issue will enhance our knowledge and understanding in the field of joining and assembly. I would like to dedicate this book to my wife, Mehrnoosh, for her continued support and encouragement.

Keywords

adhesive thermos-mechanical property --- SnBi58 solder joint morphology --- flex-on-board assembly --- thermal compression bonding --- ultrasonic bonding --- friction stir welding --- scarf joint --- butt joint --- tool pin profiles --- mechanical properties --- microstructure --- metallurgy --- vacuum brazing --- titanium --- eutectoid --- clad filler foil --- microstructure --- SA213-T23 --- Cr-Mo steel --- heat-affected zone --- m23c6 --- carbide dissolution --- tint etching --- high-crystalline content zirconia --- active monomers --- oxide layer --- solder --- ceramics --- copper --- flux-less soldering --- IN738 superalloy --- welding --- HAZ cracking --- microconstituent --- plasma-TIG --- coupled arc --- arc profile --- pressure distribution --- welding --- 22MnB5 --- flow stress --- thermophysical property --- numerical simulation --- hybrid joining --- surface structuring --- thermal spraying --- coating --- FRP --- hot pressing --- bonding strength --- adhesion --- mechanical interlocking --- phased array ultrasonic --- dissimilar weldments --- anisotropy --- longitudinal wave --- simulation --- dissimilar material joining --- carbon fiber-reinforced polymer --- dual-phase steel --- friction bit joining --- adhesive bonding --- weld bonding --- mechanical strength --- rotary friction-welding --- energy-input --- joint mechanical properties --- welding thermal cycles --- medium thick plate model --- distributed point heat sources model --- local brittle zone --- API 5L X80 steel --- Ti2AlNb alloy --- TAN alloy --- direct diffusion bonding --- interfacial microstructure --- mechanical properties --- friction stir welding --- aluminum --- copper --- dissimilar joints --- design of experiments --- taguchi design --- mechanical properties --- electrical properties --- tailor welded blanks --- laser welding --- Zn-coated low carbon microalloyed steels --- microstructure --- pores

Fracture, Fatigue and Structural Integrity of Metallic Materials

Authors: ---
ISBN: 9783039288595 / 9783039288601 Year: Pages: 170 DOI: 10.3390/books978-3-03928-860-1 Language: eng
Publisher: MDPI - Multidisciplinary Digital Publishing Institute
Subject: Technology (General) --- General and Civil Engineering
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Fracture, fatigue, and other subcritical processes, such as creep crack growth or stress corrosion cracking, present numerous open issues from both scientific and industrial points of view. These phenomena are of special interest in industrial and civil metallic structures, such as pipes, vessels, machinery, aircrafts, ship hulls, and bridges, given that their failure may imply catastrophic consequences for human life, the natural environment, and/or the economy. Moreover, an adequate management of their operational life, defining suitable inspection periods, repairs, or replacements, requires their safety or unsafety conditions to be defined. The analysis of these technological challenges requires accurate comprehensive assessment tools based on solid theoretical foundations as well as structural integrity assessment standards or procedures incorporating such tools into industrial practice.

Novel Methods and Applications for Mineral Exploration

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ISBN: 9783039289431 / 9783039289448 Year: Pages: 264 DOI: 10.3390/books978-3-03928-944-8 Language: eng
Publisher: MDPI - Multidisciplinary Digital Publishing Institute
Subject: Science (General) --- Geology --- Earth Sciences
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This special volume offers a snapshot of the latest developments in mineral exploration, in particular, geophysical, geochemical, and computational methods. It reflects the cutting-edge applications of geophysics and geochemistry, as well as novel technologies, such as in artificial intelligence and hyperspectral exploration, methods that have profoundly changed how exploration is conducted. This special volume is a representation of these cutting-edge and pioneering methods to consider and conduct exploration, and should serve both as a valuable compendium of the most innovative exploration methodologies available and as a foreshadowing of the form of future exploration. As such, this volume is of significant importance and would be useful to any exploration geologist and company

Laser Welding

Authors: ---
ISBN: 9783039288618 / 9783039288625 Year: Pages: 260 DOI: 10.3390/books978-3-03928-862-5 Language: eng
Publisher: MDPI - Multidisciplinary Digital Publishing Institute
Subject: Technology (General) --- General and Civil Engineering
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Laser welding is a high-energy process used in a wide range of advanced materials to obtain micro- to macro-sized joints in both similar and dissimilar combinations. Moreover, this technique is widely used in several industries, such as automotive, aerospace, and medical industries, as well as in electrical devices. Although laser welding has been used for several decades, significant and exciting innovations often arise from both the process and/or advanced materials side.

Keywords

laser beam welding --- buy-to-fly --- L-joint --- T-joint --- Ti–6Al–4V --- dissimilar joining --- laser welding-brazing --- finite element method --- titanium --- aluminium --- laser welds --- mechanical properties --- low alloyed steel --- dual phase steel --- trip steel --- laser beam welding --- conduction regime --- Ti-5Al-5V-5Mo-3Cr --- laser offset welding --- hybrid welding --- microstructure --- intermetallic layer --- pulsed Nd:YAG laser beam welding --- DP1000 steel --- penetration --- hardness --- phase transformation --- dissimilar welding --- fiber laser --- finite element analysis --- laser welding --- spatter --- liquid metal --- high-speed imaging --- porosity control --- laser stake welding --- aluminum alloy T-joint --- aided electric current --- weld morphology --- mechanical properties --- Al/steel joints --- laser keyhole welding --- IMC layers --- tensile properties --- EBSD phase mapping --- high temperature titanium alloy --- laser welding --- microstructure --- mechanical properties --- BTi-6431S --- fiber laser welding --- dissimilar material --- stainless steel --- microstructure --- hardness --- tensile strength --- steel S700MC --- hybrid welding --- HLAW --- laser beam --- MAG --- magnesium alloy thin sheet --- fiber laser welding --- microstructure --- mechanical properties --- H-shaped fusion zone --- laser welding --- keyhole --- weld pool behavior --- mass transfer --- dissimilar metal --- LKW --- WW --- prediction --- accuracy --- SKM --- WPP --- n/a

Systems Analytics and Integration of Big Omics Data

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ISBN: 9783039287444 / 9783039287451 Year: Pages: 202 DOI: 10.3390/books978-3-03928-745-1 Language: eng
Publisher: MDPI - Multidisciplinary Digital Publishing Institute
Subject: Medicine (General) --- Therapeutics
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A “genotype"" is essentially an organism's full hereditary information which is obtained from its parents. A ""phenotype"" is an organism's actual observed physical and behavioral properties. These may include traits such as morphology, size, height, eye color, metabolism, etc. One of the pressing challenges in computational and systems biology is genotype-to-phenotype prediction. This is challenging given the amount of data generated by modern Omics technologies. This “Big Data” is so large and complex that traditional data processing applications are not up to the task. Challenges arise in collection, analysis, mining, sharing, transfer, visualization, archiving, and integration of these data. In this Special Issue, there is a focus on the systems-level analysis of Omics data, recent developments in gene ontology annotation, and advances in biological pathways and network biology. The integration of Omics data with clinical and biomedical data using machine learning is explored. This Special Issue covers new methodologies in the context of gene–environment interactions, tissue-specific gene expression, and how external factors or host genetics impact the microbiome.

Keywords

tissue-specific expressed genes --- transcriptome --- tissue classification --- support vector machine --- feature selection --- bioinformatics pipelines --- algorithm development for network integration --- miRNA–gene expression networks --- multiomics integration --- network topology analysis --- candidate genes --- gene–environment interactions --- logic forest --- systemic lupus erythematosus --- Gene Ontology --- KEGG pathways --- enrichment analysis --- proteomic analysis --- plot visualization --- Alzheimer’s disease --- dementia --- cognitive impairment --- neurodegeneration --- Gene Ontology --- annotation --- biocuration --- amyloid-beta --- microtubule-associated protein tau --- artificial intelligence --- genotype --- phenotype --- deep phenotype --- data integration --- genomics --- phenomics --- precision medicine informatics --- epigenetics --- chromatin modification --- sequencing --- regulatory genomics --- disease variants --- machine learning --- multi-omics --- data integration --- curse of dimensionality --- heterogeneous data --- missing data --- class imbalance --- scalability --- genomics --- pharmacogenomics --- cell lines --- database --- drug sensitivity --- data integration --- omics data --- genomics --- RNA expression --- non-omics data --- clinical data --- epidemiological data --- challenges --- integrative analytics --- joint modeling --- multivariate analysis --- multivariate causal mediation --- distance correlation --- direct effect --- indirect effect --- causal inference --- n/a

Microwave Imaging and Electromagnetic Inverse Scattering Problems

Authors: ---
ISBN: 9783039219506 / 9783039219513 Year: Pages: 170 DOI: 10.3390/books978-3-03921-951-3 Language: eng
Publisher: MDPI - Multidisciplinary Digital Publishing Institute
Subject: Technology (General) --- General and Civil Engineering
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Microwave imaging techniques allow for the development of systems that are able to inspect, identify, and characterize in a noninvasive fashion under different scenarios, ranging from biomedical to subsurface diagnostics as well as from surveillance and security applications to nondestructive evaluation. Such great opportunities, though, are actually severely limited by difficulties arising from the solution of the underlying inverse scattering problem. As a result, ongoing research efforts in this area are devoted to developing inversion strategies and experimental apparatus so that they are as reliable and accurate as possible with respect to reconstruction capabilities and resolution performance, respectively. The intent of this Special Issue is to present the experiences of leading scientists in the electromagnetic inverse scattering community, as well as to serve as an assessment tool for people who are new to the area of microwave imaging and electromagnetic inverse scattering problems.

High Voltage Engineering and Applications

Author:
ISBN: 9783039287161 / 9783039287178 Year: Pages: 304 DOI: 10.3390/books978-3-03928-717-8 Language: eng
Publisher: MDPI - Multidisciplinary Digital Publishing Institute
Subject: Technology (General) --- General and Civil Engineering
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This book is a collection of recent publications from researchers all over the globe in the broad area of high-voltage engineering. The presented research papers cover both experimental and simulation studies, with a focus on topics related to insulation monitoring using state-of-the-art sensors and advanced machine learning algorithms. Special attention was given in the Special Issue to partial discharge monitoring as one of the most important techniques in insulation condition assessment. Moreover, this Special Issue contains several articles which focus on different modeling techniques that help researchers to better evaluate the condition of insulation systems. Different power system assets are addressed in this book, including transformers, outdoor insulators, underground cables, and gas-insulated substations.

Keywords

space/interface charge --- electrical field strength --- temperature --- oil-paper insulation --- simulation --- bipolar charge transport model --- earthing systems --- electrode’s geometry --- fast-impulses --- high-magnitude currents and impulse polarity --- grounding --- grounding electrodes --- high impulse conditions --- seasonal --- soil resistivity --- partial discharges (PD) --- partial discharge --- calibrator --- Tettex 9520 --- DDX 8003 --- DDX 9121b --- secondary arc --- short-circuit discharge --- numerical modeling --- plasma discharge --- post insulator --- non-uniform pollution between windward and leeward sides --- residual resistance formulation --- flashover dynamic model --- artificial flashover tests --- flashover characteristics --- feature selection --- insulation health index --- machine learning --- oil/paper insulation --- transformer asset management --- thermal effect --- cable --- XLPE --- laying modes --- Comsol Multiphysics --- thermal parameters --- cable ampacity --- partial discharge --- surface discharge --- UHF sensor --- FDTD simulation --- cavity discharge --- partial discharge --- denoising --- RF signal --- wavelet transform --- artificial neural network --- curve fitting --- saline mechanism --- shoreline --- wind speed --- outdoor insulators --- dry band arcing --- flashover --- tracking --- ageing --- hydrophobicity --- leakage current --- dry band arcing --- degradation --- polymeric insulation --- tracking test setup --- composite insulator --- dry band formation --- heat transfer model --- generalized finite difference time domain --- corona discharge --- electric field analysis --- ion flow field --- space charge density --- UFVM --- partial discharge --- optical-UHF integrated detection --- photoelectric fusion pattern --- GIL --- NSCT --- cable joint --- charge simulation method --- electrical tree --- random walk theory --- finite element analysis --- partial discharge modeling --- high-frequency --- fast-rise square wave voltages --- silicone gel --- wide bandgap power modules --- surface discharge --- flashover --- gas --- modelling --- pressure --- thermal properties

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MDPI - Multidisciplinary Digital Publishing Institute (7)


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CC by-nc-nd (7)


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eng (7)


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2020 (7)